Takatori Corporation

This machine laminates double-sided tape onto wafers, remove cover film on it, and attaches wafers and substrates.
Lamination of wafer and double-sided tape & attachment of wafers and substrates is made in Takatori unique vacuum chamber.
So the laminating without air bubbles and with uniform attaching pressure is available.

The machine supports FOWLP process.
It can also be used with HBM wafer support.