Introduction to Products

TEAM-300A　

FEATURES

  • Vacuum laminator compatible with various types of films.
  • Dry-resist film saves resist solution drastically in the conventional wet resist process
  • Cutting film smaller allows the exposed area on a wafer edge part in accordance with the plate electrode.
  • Laminating film in a vacuum chamber prevents bubbles on the film as well as damages to the wafer.
  • Film is laminated in the manner of non-tension avoiding any stress.
  • Clean capability for front-end process.(option)
  • TEAM-300B supports 300mm substrates.
    It supports FOPLP and chiplet.

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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