Introduction to Products

WSM-200　

FEATURES

  • No tape tensioning mounting onto ultra wafers because of Vacuum chamber.
  • Detaching glasses from ultra thin wafers with no stress because of special handling technique.
  • Either one (UV unit or heater table) can be selected.
  • It can be used with HBM wafer support.

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TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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