Introduction to Products

Semiconductor Equipment

Takatori develops semiconductor manufacturing equipment that supports the core of computer systems and electronic devices.
To meet growing demand in AI servers, EVs, autonomous driving, and industrial automation, Takatori focuses on R&D for advanced fan-out packaging technologies, including GPUs, HBM (High Bandwidth Memory), and PLP (Panel Level Packaging).

Table of Individual Semiconductor Manufacturing Processes

Table of Individual Work Sizes

Panel Level Package / Substrate (PLP)

New model lineup

Tape automatic replacement mechanism
Vacuum laminator for PLP

Equipment applicable to LED/RF Device

Fully Automatic Dry Liftoff Machine
Sapphire Substrate Mounter
Tape Replacement Machine
Fully Automatic Package Mounter

Equipment applicable to TAIKO® Process

Wafer Mounter
ATRM-2400TKUV

Wafer Protective Tape Lamination Machines

TEAM-100
ATM-1100G
ATM-1100K
ATM-3100
ATM-3000EF

Wafer Protective Tape Removal Machines

ATRM-2300
ATRM-2400TKUV
ATRM-4000

Wafer Mounters

ATM-8200A
ATM-8100S
SAM-8
ATM-8100X
ATM-12000DR

UV Irradiation Equipment

TUV-1
TUV-M
TUV-12

Film Resist Lamination Machines

TEAM-100ARF
ATM-1100K
VTM-200M
TEAM-300
ATM-3000EF
VTM-300

Package Mounters

ATM-9000
ATM-9500(Supports Eco Ring)

Equipment applicable to Substrate (H-WSS) Processing (Attaching)

WSM-100
GWS-300M
GWSM-300M

Equipment applicable to Substrate (H-WSS) Processing (Detaching)

WSM-200
GWS-300R
GWSM-300R

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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