What do we need to make a breakthrough?
It’s a passion never allow us to satisfy with things as they are.
It’s a resolution to stay on path of challenging.
“How can we create something even better?”
We have developed our own core technologies
with our motto “Creation and Innovation”.
And now, what we are thinking is to make a breakthrough
in manufacturing across industry boundaries
with innovators in all fields who keep challenging.
Go beyond innovation.
Let’s work together for our new future.
We believe that our own core technologies
contribute you creating your products
and service with high added value.
Vacuum technology
We made it possible by merging some mechanism such as heating and pressuring under vacuum. It works for various sizes and materials and we achieved lamination not only on flat surface but also on curved surface without air ingress.
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Air bubbles removal technology under vacuum
Our own jig and pressure mechanism enabled transfer lamination and pressure with roller under vacuum, contributing to removal of air bubbles.
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Cutting technology
We have wire saws to cut crystal materials such as SiC or sapphire by running a wire and also automatic cutting machines for apparel fabric and advanced materials such as tailplane.
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Cutting technology for airplane materials
Honey comb materials for airplane can be cut with high accuracy. 3D cutting is also available.
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Transfer technology
Various technologies such as non-contact transfer allowed us to carry precise parts without any strains. Also sophisticated tension control enables metal wire with a diameter of 100μm to run at high speed.
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Precise transfer technology of wafers
With non-contact transfer technology, wafers for IC chip (Semiconductor integrated circuit) can be transferred with no strain.
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Lamination technology
Our lamination technology allows you to rapidly and precisely laminate a sheet on organic EL display panel without air ingress, and also it is adaptable to a wide range of lamination processes and tapes. It takes advantage of delicate tension control and automatic position control technologies.
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Refined lamination technology on wafers
Our technology works for laminating protection tape on delicate surface of semiconductor wafers and for laminating a film on instrument panels with curved surface shape.
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Separation technology
Our mechanical system and robot technology realized precise separation of films and tapes. Integration of heating and UV radiation technologies works for reducing strains on wafers.
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Technology for sure separation from wafers
The technology allows you to remove a protection tape without fail from wafers cut into small chips.
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Control technology
Our cutting machines achieved leading-edge cutting ability and functionality by sophisticated control technologies such as wire tension control based on unique program operation and cutting control by image recognition.
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Cutting technology for apparel fabric
Image recognition technology gets a picture of fabric shape and precisely cut without CAD data.
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Grind technology
Our device has the technology enables you to precisely grind various semiconductor or magnetic materials to submicron thickness and sub nano-level surface roughness and the technology purging foreign materials on panel surface by 2D vibration and pressure control.
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Precise grind technology for advanced materials
This technology works for mirror-like finishing for advanced materials such as SiC, GaN, and sapphire used for LED and semiconductor.
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Measurement technology
Machine stable operation takes advantage of the control system preliminarily detecting machine troubles, technology measuring wire tension or workpiece thickness in real-time, and correcting positions after measurement with image recognition system.
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Predictive maintenance technology for machine troubles
The technology can predict the timing of maintenance by monitoring wear state of bearings installed in machines. It helps to obviate the risk of troubles or breakdown.
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