Introduction to Products

ATM-1100G　

FEATURES

  • Special controlled cutting along the wafer contour after tape lamination ensures the production of uniform and high precision taper laminates free from bubbles.
  • Special controlled cutting provides notched wafers and all-angle secondary flat positioned wafers.
  • Ensures lower running cost.
  • Without providing tape tension onto wafer, wafer does not have any stress after Back Grinding.

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TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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