Introduction to Products

ATM-1100GC 　(Tape Laminating machine)

FEATURES

  • After laminating the tape, the tape is cut according to the external dimensions of the wafer to ensure highly accurate, bubble-free, and uniform lamination.
  • Wafers with notches and second flat of any angle are applicable.
  • Running costs can be reduced.
  • Cutter unit vertical mechanism contributes to longer blade life.

 

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

PAGETOP