Introduction to Products

ATM-1100K　

FEATURES

  • Lamination pressure on and the temperature of whole wafer surface are uniformed.
  • DFR lamination roller temperature is precisely controlled.
  • DFR lamination tension is uniformed (Non-tension lamination and tenting lamination
    are available.)
  • Corresponding to protective tape lamination for back-grind process
  • Environment friendly design (long life consumable parts, minimizing film consumption etc.)
  • Improved workability

Online Catalog

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