Introduction to Products

ATM-8100S　

FEATURES

  • Mounting minimum 150-micron thick and max 5 mm-warped wafers.
  • No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
  • To process thin warped wafers, correcting the warpage inside vacuum chamber.
  • Memorizing tape tension to meet wide range of tapes.

Online Catalog

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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