ATM-8100X｜Semiconductor Equipment｜Introduction to Products｜Takatori Corporation

Introduction to Products

ATM-8100X　

FEATURES

Applicable precut tape, non-precut tape.(Non-precut tape is option)
B/G tape removal function after mounting.
Applicable ultra thin wafer.
Wafer supply is available from open cassette, coinstack cassette.(Coinstack cassette is available as option)

Semiconductor Equipment

New model lineup

Equipment applicable to LED

Equipment applicable to TAIKO Process

Wafer Protective Tape Lamination Machines

Wafer Protective Tape Removal Machines

UV Irradiation Equipment

Film Resist Lamination Machines

Package Mounters

Equipment applicable to Substrate (H-WSS) Processing (Attaching)

Equipment applicable to Substrate (H-WSS) Processing (Detaching)

Advanced Materials Manufacturing Equipment

Display Equipment

Textile Equipment

Medical Devices