ATM-9000｜Semiconductor Equipment｜Introduction to Products｜Takatori Corporation

Introduction to Products

ATM-9000　

FEATURES

Lamination in vacuum state allows bubble-free lamination even on different levels.
Multiple package lamination is available.
Applicable to ECO ring allowing lamination without wasting tape.

TAIKO^® is a registered trademark of DISCO Corporation in Japan and other countries.

Semiconductor Equipment

New model lineup

Equipment applicable to LED

Equipment applicable to TAIKO^® Process

Wafer Protective Tape Lamination Machines

Wafer Protective Tape Removal Machines

UV Irradiation Equipment

Film Resist Lamination Machines

Package Mounters

Equipment applicable to Substrate (H-WSS) Processing (Attaching)

Equipment applicable to Substrate (H-WSS) Processing (Detaching)

Advanced Materials Manufacturing Equipment

Display Equipment

Textile Equipment

Medical Devices