Introduction to Products

ATRM-2400TKUV 　

FEATURES

  • The wafer is not damaged by adopting the original transfer technology that matches the TAIKO® shape and the non-contact removal technology of the ground surface by a special stage.
  • It has a footprint that is half that of the previous machine (ATRM-2300TKUV) and is the smallest in the world. Space saving (W1000 x D980mm)
  • Built-in UV irradiation function (optional)
  • In addition, we can customize it according to your needs.

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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