The wafer is not damaged by adopting the original transfer technology that matches the TAIKO shape and the non-contact removal technology of the ground surface by a special stage.
It has a footprint that is half that of the previous machine (ATRM-2300TKUV) and is the smallest in the world. Space saving (W1000 x D980mm)
Built-in UV irradiation function (optional)
In addition, we can customize it according to your needs.