ATRM-2500UV Protective tape removal machine (Tapeless removal machine)
FEATURES
- Contributes to production cost reductions because conventional removal tape is not required.
- Operator workload is reduced since no need to replace the removal tape.
- Needle height control by our unique technology eliminates the risk of the wafer damage. Also, the needle height can be controlled by a recipe according to wafer thickness.
- Applicable to thin wafers of 100 µm thickness and warped wafers.
- Unlike adhesive or welded removal methods, the tape is mechanically chucked and removed, reducing tape compatibility problems.
- Even when removal with needle is not acceptable, the conventional removal tape mechanism is also available. *Conventional removal tape mechanism is available as standard.
- Capable of handling conveyance along the workpiece, such as non-contact hand, etc. (Option)
- TAIKO® wafer can be handled. (Option)
- Built-in UV irradiator can be mounted. (Option)
TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.
