Introduction to Products

Fully Automatic Dry Liftoff Machine　AMR-2200G

FEATURES

  • Removal of resist and unnecessary metal film on wafers is performed using a dry method (mechanical peeling method).
  • The dry method allows metal to be recovered easily and eliminates the requirement for chemical processing.
  • Compared to the wet method, the dry method contributes to reduced running costs and subsequent processing.

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TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

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