Tape is attached to the substrate in a vacuum, enabling bubble-free application. In addition, as this is a pressure differential-based application method, there is no stress on the wafer.
The series also supports thin membrane φ3, 4, 5, 6 inch substrates with thin films of 100 m or less.
It also supports a function that reads wafer IDs and issues barcodes (option).
In addition, customized specifications can be created to meet client requests.