Introduction to Products

SAM-8C　

FEATURES

  • No air bubble, nodamage for wafer by mounting wafer in vacuumed atmosphere.
  • Contactless mounting table which holds wafer at 3mm edge part.(the vacuum to hold wafer is not necessary.)
  • Saving tape consumption, possible to set other frame in wafer mounting, contributing operation efficiency by separating wafer mounting part.
  • Automatic tape supply, tape coiling, wastage tape coiling, tape cutting. (UV tape applicable)
  • Table height can be controlled byu touch panel

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