SAM-8C
FEATURES
- No air bubble, nodamage for wafer by mounting wafer in vacuumed atmosphere.
- Contactless mounting table which holds wafer at 3mm edge part.(the vacuum to hold wafer is not necessary.)
- Saving tape consumption, possible to set other frame in wafer mounting, contributing operation efficiency by separating wafer mounting part.
- Automatic tape supply, tape coiling, wastage tape coiling, tape cutting. (UV tape applicable)
- Table height can be controlled byu touch panel

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.