Introduction to Products

TEAM-100ARF　

FEATURES

  • By laminating the film and wafer in a vacuum condition, it is possible to laminate the tape without air bubbles even on steps. 
  • By making a dry resist film, waste of resist liquid in the conventional wet resist process can be greatly reduced. 
  • The mounting in vacuum eliminates the generation of air bubbles and does not damage the wafer. 
    By cutting to the film size set on the inner circumference of the wafer, the peripheral part of the wafer can be exposed to the plated electrodes. 

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