Introduction to Products

TEAM-300　

FEATURES

  • Correspondence to various kind of film.
  • Dry-resist film saves resist solution drastically in the conventional wet resist process
  • Cutting film smaller allows the exposed area on a wafer edge part in accordance with the plate electrode.
  • Laminating film in a vacuum chamber prevents bubbles on the film as well as damages to the wafer.
  • Film is laminated in the manner of non-tension avoiding any stress.
  • Clean capability for front-end process.(option)

Online Catalog

PAGETOP