TEAM-300
FEATURES
- Correspondence to various kind of film.
- Dry-resist film saves resist solution drastically in the conventional wet resist process
- Cutting film smaller allows the exposed area on a wafer edge part in accordance with the plate electrode.
- Laminating film in a vacuum chamber prevents bubbles on the film as well as damages to the wafer.
- Film is laminated in the manner of non-tension avoiding any stress.
- Clean capability for front-end process.(option)

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.