VTM-200M｜Semiconductor Equipment｜Introduction to Products｜Takatori Corporation

Introduction to Products

VTM-200M　

FEATURES

Applicable to tenting lamination, embedding lamination, ultra-thick resist lamination, conformal lamination and gas hermetic lamination etc. to wafer rough surface.
For best lamination condition, applicable to setting laminating roller speed, roller table temperature and laminating vaccum pressure.

Semiconductor Equipment

New model lineup

Equipment applicable to LED

Equipment applicable to TAIKO Process

Wafer Protective Tape Lamination Machines

Wafer Protective Tape Removal Machines

UV Irradiation Equipment

Film Resist Lamination Machines

Package Mounters

Equipment applicable to Substrate (H-WSS) Processing (Attaching)

Equipment applicable to Substrate (H-WSS) Processing (Detaching)

Advanced Materials Manufacturing Equipment

Display Equipment

Textile Equipment

Medical Devices