Introduction to Products

GWS-300M　

FEATURES

  • This machine laminates double-sided tape onto wafers, remove cover film on it, and attaches wafers and substrates.
    Lamination of wafer and double-sided tape & attachment of wafers and substrates is made in Takatori unique vacuum chamber.
    So the laminating without air bubbles and with uniform attaching pressure is available.

Online Catalog

TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.

PAGETOP