We will introduce our vacuum laminator technology for 512mm square substrates on the panel. This system is a multi-laminator that can mount not only square substrates but also 12-inch wafers and 12-inch dicing rings. It can be used for a wide range of applications. In addition, we will exhibit a variety of machines that utilizes our unique laminating, removing, and vacuum technologies, such as an automatic tape changing mechanism and support for TAIKO wafers.
We will exhibit the world's first labor-saving and space-saving automated grinding machine (GLAPPING-SiC).
We look forward to seeing you at the exhibition.
Dates: Wednesday, January 22, 2025 - Friday, January 24, 2025
Venue: Tokyo Big Sight
Booth NO.: Hall 3, E26-51
