When assembling LCD panels, TCP's and driver boards are precisely positioned and installed on glass panels to lead electrodes. Those components are then thermo compressed to attach together in a latter process. To position the parts, a high-resolution camera recognizes the alignment marks and a precisely controlled drive axis aligns the parts.
With this technology, ultra-thin wafers are transferred without any induced stress. This technology features uniform vacuum support over the complete wafer surface enabling high speed transfer and precise positioning.
